Copper foilchinhu chinodiwa mukugadzira bhodhi redunhu nekuti ine mabasa mazhinji akadai sekubatanidza, conductivity, kupisa kupisa, uye electromagnetic shielding. Kukosha kwaro kunobuda pachena. Nhasi ndichakutsanangurira nezveyakakungurutswa yemhangura foil(RA) uye Musiyano uripoelectrolytic mhangura foil(ED) uye kupatsanurwa kwePCB mhangura foil.
PCB yemhangura foilchinhu chinoitisa chinoshandiswa kubatanidza zvinhu zvemagetsi pamabhodhi edunhu. Zvinoenderana nemaitiro ekugadzira uye kuita, PCB yemhangura foil inogona kukamurwa kuita mapoka maviri: yakakungurutswa yemhangura foil (RA) uye electrolytic copper foil (ED).
Yakakungurutswa foil yemhangura inogadzirwa neakachena mhangura blanks kuburikidza nekuenderera mberi kukunguruka uye kumanikidza. Iine nzvimbo yakatsetseka, yakaderera roughness uye yakanaka conductivity yemagetsi, uye yakakodzera kune yakakwirira-frequency chiratidzo chekufambisa. Nekudaro, mutengo wefoiri yemhangura yakakungurutswa wakakwira uye ukobvu huwandu hushoma, kazhinji pakati pe9-105 µm.
Electrolytic copper foil inowanikwa ne electrolytic deposition processing pandiro yemhangura. Rimwe divi rakatsetseka uye rimwe divi rakakasharara. Rutivi rwakakasharara rwakasungirirwa kune substrate, nepo rutivi rwakatsetseka ruchishandiswa pa electroplating kana etching. Zvakanakira zve electrolytic copper foil mutengo wayo wakaderera uye huwandu hwakawanda hwehukobvu, kazhinji pakati pe5-400 µm. Zvisinei, kushata kwayo kwepamusoro kwakakwirira uye magetsi ayo haana kunaka, zvichiita kuti isakodzere kufambiswa kwechiratidzo chepamusoro-frequency.
Kurongeka kwePCB copper foil
Mukuwedzera, maererano nekuoma kwe electrolytic copper foil, inogona kugoverwa zvakare mumhando dzinotevera:
HTE(High Temperature Elongation): Yepamusoro-tembiricha elongation yemhangura foil, inonyanya kushandiswa mune akawanda-layer redunhu mabhodhi, ine yakanaka yepamusoro-tembiricha ductility uye kusimba kwekubatanidza, uye kushata kunowanzo pakati pe4-8 µm.
RTF(Reverse Treat Foil): Reverse tora foil yemhangura, nekuwedzera yakananga resin coating padivi rakatsetseka re electrolytic copper foil kuti uvandudze kuita kwekunamira uye kuderedza kushata. Kukasharara kunowanzova pakati pe2-4 µm.
ULP(Ultra Low Profile): Ultra-yakaderera mbiri yemhangura foil, yakagadzirwa uchishandisa yakakosha electrolytic process, ine yakanyanya kuderera pamusoro roughness uye inokodzera yakakwirira-kumhanya chiratidzo chekufambisa. Kukasharara kunowanzova pakati pe1-2 µm.
HVLP(High Velocity Low Profile): High-speed low-profile copper foil. Kubva paULP, inogadzirwa nekuwedzera iyo electrolysis kumhanya. Iine yakaderera pamusoro roughness uye yakakwirira kugadzirwa kunyatsoshanda. Kukasharara kunowanzova pakati pe0.5-1 µm. .
Nguva yekutumira: May-24-2024